A new technical paper titled “Channel-last gate-all-around nanosheet oxide semiconductor transistors” was published by ...

A new technical paper titled “Deep-learning atomistic semi-empirical pseudopotential model for nanomaterials” was published ...

A new technical paper titled “Hardware Acceleration for Neural Networks: A Comprehensive Survey” was published by researchers ...

In the past, analysts, consultants, and many other experts attempted to estimate the cost of a new chip implemented in the latest process technology. They concluded that by the 3nm node, only a few ...

Generative Golden Reference Hardware Fuzzing” was published by researchers at TU Darmstadt. Abstract “Modern hardware systems ...

A new technical paper titled “Making Strong Error-Correcting Codes Work Effectively for HBM in AI Inference” was published by researchers at Rensselaer Polytechnic Institute, ScaleFlux and IBM T.J.

In-space IC materials; TSMC's 2nm volume production; Chinese hybrids flood Europe; copper price surges; SMIC's takeover; ...

What chip industry engineers were watching this year.

The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices. Scaling is still on the list, with the ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.

Designers are utilizing an array of programmable or configurable ICs to keep pace with rapidly changing technology and AI.